Wafer Bonding Process Engineer

Job Description

Job Title: Wafer Bonding Process Engineer, Quantum AI. Location: Goleta, California, USA

Responsibilities:

• Develop, integrate, and transition temporary adhesive bonding and laser debonding processes and equipment into production for advanced 3D integration of quantum devices.

• Specify, bring up, and qualify required cleanroom equipment and advanced metrology capabilities.

• Establish baseline operating recipes and process documentation.

• Lead process integration activities involving wafer thinning, thin-wafer handling, and stress and warp mitigation.

• Coordinate vendor evaluations, off-site demonstrations, and technology transfers;

• Transition validated tools and processes into production workflows for quantum devices.

• Troubleshoot process anomalies and improve manufacturing yield.

• Train cleanroom personnel and technicians on standard operating procedures.

Qualifications:

• Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field such as Optics, Sensors, or Audio/DSP, or equivalent practical experience.

• At least 3 years of experience developing, sustaining, or integrating semiconductor fabrication processes in an R&D or cleanroom production environment.
• At least 3 years of experience in one or more of the following:
  • Temporary wafer bonding
  • Laser or thermal debonding
  • Thin-wafer handling
  • Back-end packaging processes

Preferred:

• Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or a related field.

• Experience mitigating mechanical stress, bow, warp, and micro-cracking in ultra-thin silicon substrates.

• Experience with backside thinning and dicing-on-tape workflows.

• Experience developing and executing 3D integration technical roadmaps.

• Experience leading complex development and process integration projects;

• Strong collaborative leadership skills.

• Experience leading technical evaluations with equipment vendors and managing joint development projects.

• Experience mentoring engineers and technicians and providing cross-training.

• Expertise in polymer adhesives, temporary bonding materials, and release processes.

• Experience qualifying automated temporary bonding, lamination, and laser or mechanical debonding tools.

Salary:

$159,000–$230,000 USD

Additional compensation and benefits include:

• 15% target bonus.

• Equity.

• Employee benefits.

Individual pay depends on job-related skills, experience, education, and training. Equity grants are discretionary and subject to Alphabet Inc.'s approval and applicable stock plan terms.

Application Instructions:

Apply through Google's official careers website.

Google requires English proficiency for this role unless otherwise stated in the job posting.

Applicants who require accommodation during the application process can submit Google's Accommodations for Applicants form.

Additional Information:

• Google Quantum AI focuses on developing large-scale quantum computers capable of complex, error-corrected computations.

• Google is an equal opportunity and affirmative action employer.

• Google does not accept unsolicited resumes from recruitment agencies and is not responsible for fees related to them.

• Information collected through Google Careers profiles and job applications is subject to Google's Applicant and Candidate Privacy Policy.