Job Description
Job Title: Associate Optical Packaging Engineer. Location: Milpitas, California, United States
Responsibilities:
- Support hands-on manufacturing of fiber-to-chip packaged chip assemblies
- Assist with development, optimization, and validation of optical packaging and active alignment processes
- Perform process characterization activities including alignment, adhesive curing, and optical performance evaluation
- Execute experiments and collect data to improve optical coupling efficiency, process stability, and assembly yield
- Support New Product Introduction (NPI) activities through process development, documentation, and production readiness efforts
- Troubleshoot manufacturing and reliability issues using structured problem-solving methods;
- Develop and maintain work instructions, process flows, and control plans
- Collaborate with design, manufacturing, test, and reliability engineering teams
- Support equipment setup, calibration, qualification, and maintenance activities
- Evaluate materials, tooling, and process improvements with vendors and internal teams;
- Analyze process and metrology data to identify opportunities for yield and quality improvements
Qualifications:
- Bachelor’s or Master’s degree in Engineering, Physics, Materials Science, or a related technical field
- 1 to 3 years of experience in semiconductor packaging, photonics, optics, or advanced manufacturing environments
- Understanding of optical alignment, fiber optics, and optical measurement techniques;
- Experience working with semiconductor assembly, precision alignment systems, or automated manufacturing equipment
- Hands-on laboratory or manufacturing experience with precision assemblies and metrology tools
- Strong communication and collaboration skills
- Strong analytical and problem-solving abilities in fast-paced development environments
Preferred:
- Familiarity with photonic integrated circuit (PIC) packaging or optical module assembly
- Experience using Python, MATLAB, Excel, JMP, or similar data analysis tools
- Knowledge of statistical process control (SPC), design of experiments (DOE), or yield analysis techniques
Benefits And Compensation:
- Base salary range of $85,000 to $120,000 annually within the United States
- Bay Area salary range of $115,000 to $130,000 annually
- Equity opportunities for eligible employees;
- Comprehensive benefits package
- Opportunity to contribute to large-scale fault-tolerant quantum computing technology development
Other Information:
- Applicants must include the word "purple" in their cover letter submission
- Employment eligibility and work authorization requirements apply
- Equal opportunity employer committed to diversity and inclusion;
- Only official company email addresses will be used during the hiring process
- Unsolicited agency resumes are not accepted
LOCATION
JOB TYPE
Entry LevelCOMPENSATION
$85k - $130k
SKILLS
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