Quantum Package & Motherboard Engineer

Job Description

Job Title: Senior Quantum Package & Motherboard Engineer. Location: Redmond, Washington, USA

Job Type: Full-time (4 days per week in office)

Responsibilities:

• Develop and maintain package and motherboard design processes for quantum devices
• Create documentation and implement engineering standards across global teams
• Work with external vendors to adapt packaging materials and manufacturing processes for quantum hardware
• Design and drive PCB solutions for cryogenic and quantum computing applications;
• Perform signal integrity and power integrity simulations for package and motherboard components
• Define signaling architectures, connectors, cables, and materials from room-temperature systems to cryogenic environments
• Improve electrical and PCB development workflows, quality frameworks, validation procedures, and manufacturing readiness processes
• Lead design reviews and support design-for-manufacturing and testability initiatives;
• Collaborate with architecture, verification, analog, physical design, quantum engineering, and supplier teams
• Communicate technical recommendations to engineering and executive stakeholders
• Mentor engineers and support a collaborative engineering culture

Qualifications:

• Bachelor’s, Master’s, or Doctorate in Physics, Engineering, or a related field with relevant industry or research experience
• Ability to pass Microsoft security screening and background check requirements
• Ability to satisfy export control and citizenship verification requirements;
• Experience using AI tools to improve engineering productivity, analysis, and development workflows
• Ability to work effectively in an AI-first engineering environment

Preferred:

• Bachelor's or Master's degree in Electrical Engineering or a related discipline
• 10+ years of package design and PCB design experience
• Experience delivering package and motherboard products into production environments
• Knowledge of industry-standard package and PCB design methodologies and tools
• Experience with analog signal, power integrity, and signal integrity simulations;
• Experience designing package, motherboard, connector, and cable solutions for cryogenic systems
• Experience working with PCB development teams, fabrication vendors, electronics manufacturers, and suppliers
• Experience supporting superconducting integrated circuit development
• Strong project planning, communication, and stakeholder management skills
• Experience applying AI to accelerate analog layout and hardware development workflows

Benefits And Compensation:

• Base salary of $119,800 to $234,700 annually across most U.S. locations
• Base salary of $160,200 to $261,000 annually in San Francisco Bay Area and New York City locations
• Eligibility for additional compensation and employee benefits based on company policies
• Opportunity to contribute to the development of scalable, fault-tolerant quantum computing systems
• Collaboration with leading researchers, engineers, and industry partners

Other Information:

• Travel requirement is less than 25%
• Applications accepted on a rolling basis until the position is filled
• Employment is subject to security screening and export control compliance requirements
• Equal opportunity employer committed to diversity and inclusion