3D Packaging & Tooling Engineer

Job Description

Job Title: Senior 3D Packaging & Tooling Engineer. Location: Delft, Netherlands

Responsibilities:

• Lead customization of high-precision assembly equipment such as flip-chip bonders and die attach systems
• Develop advanced sub-micron bonding processes including thermo-compression, laser-assisted bonding, and cold welding
• Evaluate adhesives, solders, and materials for stability under thermal cycling and vacuum environments;
• Design and execute innovative 3D integration strategies such as multi-die stacking and interposer-based architectures
• Collaborate with equipment vendors to co-develop specialized tooling and hardware solutions
• Push tooling systems beyond standard specifications to meet quantum hardware requirements

Qualifications:

• BS, MS, or PhD in Mechanical Engineering, Mechatronics, Physics, or Materials Science
• 7+ years of hands-on experience with high-precision semiconductor assembly platforms
• Proven ability to achieve sub-micron placement accuracy in R&D or production environments;
• Strong understanding of 3D integration technologies such as TSVs, micro-bumps, and interposers
• Experience working with materials suitable for cryogenic environments and high vacuum conditions

Benefits and compensation:

• Competitive monthly salary with 8% annual holiday bonus
• Pension plan with 63% employer contribution and dependent coverage
• Flexible work structure with hybrid setup and open vacation policy;
• Relocation support including visa assistance, housing, and tax benefits
• Learning and development budget based on individual growth plans
• Team events, offsites, and collaborative work culture

Other information:

• Opportunity to work on next-generation quantum processors using VIO architecture
• Inclusive and diverse work environment with encouragement for underrepresented talent
• Pre-employment screening may be required