Internship System & Board Design

Job Description

Job Title: Internship System and Board Design (m/f/x). Location: Ehningen, Baden-Wurttemberg, Germany. Job Type: Internship (6–12 months, Onsite)

The internship provides a collaborative environment where you will work alongside global teams & contribute to innovations in hardware design and integration.

Duties:

• Assist in designing and testing mainboards and PCB cards for IBM’s flagship platforms.
• Explore advanced chip packaging and signal integrity challenges;
• Support automation of workflows, tools, and measurement methods.
• Conduct time and frequency domain measurements using PNA-X network analyzers and oscilloscopes.
• Validate power distribution networks and ensure design robustness.
• Analyze performance data using Python and modern data tools;
• Participate in prototype validation, issue resolution, and hardware bring-up activities.
• Collaborate with cross-border teams using Agile and Design Thinking methods.

Qualifications:

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics, or related field.
• Basic understanding of signal and power integrity and digital or analog circuit design.
• Familiarity with PCB materials, layout, and design tools such as Cadence, Synopsys, Mentor Graphics, Altium, or Eagle.
• Programming experience, preferably in Python;
• Strong motivation to learn, collaborate, and solve real engineering problems.
• Excellent teamwork and communication skills in an international environment.

Benefits and Instructions:

• Duration: 6 to 12 months starting January 2026 or later.
• Onsite internship with no travel requirement;
• Gain hands-on experience in a world-class quantum and classical hardware R&D environment.
• Opportunity to work with IBM’s experts across Germany, the US, Israel, and India.
• Develop professional skills in system design, automation, and testing;
• Apply through IBM’s official career portal. All applications must be submitted online.